Printed Circuit Board

DENORA DT® plating anodes have become the primary choice in copper-via-filling and mSAP electrodeposition processes for manufacturing both HDI printed circuit boards and semiconductor substrates.

Our insoluble anodes are largely applied by leading printed circuit board (PCB) manufacturers and are selected by equipment suppliers for: 

  • vertical continuous plating (VCP) lines and 
  • horizontal electroplating equipment.  

De Nora coatings, marketed under the DENORA DT brand, have been qualified by all main chemical vendors and are compatible with all plating chemicals, including the latest generation. 

DENORA DT anodes are the solution for today’s challenges in the electronics industry due to: 

  • uniform copper deposition,  
  • reliable via filling ability,  
  • elimination of surface roughness, and 
  • minimum additive consumption 

Uniform copper deposition, reliable via filling ability, elimination of surface roughness, and minimum additive consumption make DENORA DT anodes the solution for today’s challenge in the electronics industry. 

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Our advantages: 

DENORA DT anodes are offered in standard and custom designs to ensure optimum performance: 

  • Uniform plating distribution and excellent throwing power 
  • Extremely low additive consumption without membrane 
  • Improved plating bath life with stable performance 
  • Less bath maintenance by reducing TOC 
  • Long service life and elimination of anode maintenance reduces the cost of operation 
  • Increased equipment productivity by high current density operation 

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