Anodes for vertical plating lines in Printed Circuit Board (PCB) manufacturing

Consistent quality for high-volume PCB production.

De Nora anodes for PCB manufacturing are engineered to maximize efficiency in vertical plating lines, where panels move vertically through the plating bath to achieve precise copper deposition on multilayer and HDI boards—all while reducing operating costs.

Here’s how they support your production:

• Reliable coating performance.
  Uniform copper deposition across panels and through-holes ensures steady results for multilayer, HDI, and advanced PCB designs.

• Lower operating costs.
  Advanced DSA® mixed metal oxide catalytic coated anodes with DENORA DT top-coat reduce additive consumption and extend bath life, minimizing corrective actions and chemical expenses.

• Less maintenance, more uptime.
  Stable geometry and sludge-free operation keep electrolytes clean and lines running smoothly with fewer interventions.