Electrode TechnologiesBoost the performance of your horizontal plating line with insoluble anodes that deliver uniform copper deposition, extend bath life, and reduce chemical costs.
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Technology at a glance.
Optimized performance for your horizontal plating.
De Nora anodes for PCB manufacturing are engineered to give you control, consistency, and cost savings in horizontal plating lines, where panels move horizontally through the plating bath for precise copper deposition.
Here’s how they enhance your operations:
Uniform copper deposition.
Achieve consistent copper deposition across every panel, even at high current densities, for reliable quality on multilayer, rigid, and flexible printed circuit boards.
Reliable via filling.
Ensure dependable filling of through-holes and vias for defect-free boards.
Elimination of surface roughness.
Produce smooth surfaces, minimizing rework and enhancing end-product performance.
Minimum additive consumption.
Proprietary DT coatings reduce carriers, brighteners, and levelers (without membranes), lowering chemical costs and extending bath stability.
Lifecycle management.
Recoating and valorization services keep anodes in use, reducing waste and maximizing ROI.
UNIFORMITY
Flawless copper coverage across every PCB, even in the most complex geometries.
EFFICIENCY
Reduced chemical consumption, extended bath life, and maximized line productivity.
RELIABILITY
Stable anodes that create a sludge-free environment for clean, predictable performance over time.
Dive deeper into our anodes for horizontal plating lines.
Where our technology makes the difference.
Services for every need.
Are you ready to enhance your project?
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Plot Nos. 184, 185 & 189,
Kundaim Industrial Estate
Kundaim, Goa 403115, India
+91 832 673 1100/ 1177
info.dni@denora.com
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