Electrode TechnologiesPrinted circuit board copper plating
Ensure uniform copper deposition, extend bath life, and reduced operating costs with our anodes for electrolytic copper plating of PCBs.
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Electrode TechnologiesExplore the application.
Printed circuit board (PCB) copper plating is the process of creating the copper paths that power the board, enabling the operation of any electronic device - from smartphones to electric vehicles.
It involves the deposition and shaping of layers of copper onto a substrate, forming the conductive paths that carry electrical signals.
In the copper electroplating process, high-quality anodes ensure uniform copper deposition in through-holes, blind vias, and multilayer PCB structures.
Discover more about the process >
Printed circuit board (PCB) copper plating is the process of creating the copper paths that power the board, enabling the operation of any electronic device - from smartphones to electric vehicles.
It involves the deposition and shaping of layers of copper onto a substrate, forming the conductive paths that carry electrical signals.
In the copper electroplating process, high-quality anodes ensure uniform copper deposition in through-holes, blind vias, and multilayer PCB structures.
Discover more about the process >
Reliable PCB production is essential for delivering the performance, miniaturization, and durability that advanced electronics demand — and De Nora’s anodes make it possible by ensuring:
UNIFORMITY
Superior current distribution and excellent throwing power for reliable plating.
EFFICIENCY
Longer bath life and extremely low additive consumption, even in processes without membranes.
RELIABILITY
Stable anodes that create a sludge-free environment for clean, reproducible performance over time.
Reliable PCB production is essential for delivering the performance, miniaturization, and durability that advanced electronics demand — and De Nora’s anodes make it possible by ensuring:
UNIFORMITY
Superior current distribution and excellent throwing power for reliable plating.
EFFICIENCY
Longer bath life and extremely low additive consumption, even in processes without membranes.
RELIABILITY
Stable anodes that create a sludge-free environment for clean, reproducible performance over time.
Uniform plating for advanced PCB designs.
Our DSA® anodes deliver consistent plating quality with excellent throwing power. They enable precise copper deposition for complex PCB structures, reduce the joule effect (heating) and the related increase of power adsorption, and improve operating life.
From multilayer and HDI boards to through-hole and blind via filling, our solutions ensure stable, uniform results even at high current densities.
Efficiency that reduces total cost of ownership.
De Nora DT catalytic coatings are engineered to extend bath stability and drastically cut additive consumption, often delivering ROI in just months.
Less maintenance, fewer corrective actions, and increased line productivity help manufacturers reduce operational costs while maintaining high-quality output.
Choosing the right anodes.
Switching to insoluble anodes is complex: De Nora simplifies it with expert engineering and tailored solutions for smooth conversions and superior plating performance.
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